The 3rd International Workshop on Embedded Computing


Columbus, Ohio, USA, August 14, 2006


Final Program


The 3rd International Workshop on Embedded Computing (IWEC-06) will be held in Columbus, Ohio, August 14, 2006. IWEC 2006 takes place in conjunction with The 2006 International Conference on Parallel Processing (ICPP-06) and it is one of the major meetings for researchers to present ideas, results, and on-going research on both theoretical and practical advances in Embedded Computing.


Scope and Motivation:

The penetration of embedded computing is happening in almost every area, from low price consumer electronics to high-end aerospace and avionics environments. In today's world, automobiles, airplanes, home appliances, medical devices, cell phones, network processors, handhelds, digital audio/video, imaging, game consoles, graphics and other system-on-a-chip (SoCs) utilize embedded computers. Embedded computers, even sophisticated ones, have been used in academic and commercial products and systems, for over twenty years. However, only recently has embedded computing moved from craft to an emerging and very promising discipline.

The workshop is to bring together computer scientists, industrial engineers and researchers to discuss and exchange experimental or theoretical results, novel designs, work-in-progress, experience, case studies, and trend-setting ideas in the area of embedded computing include all aspects of embedded computing systems with emphasis on algorithms, systems, models, compilers, architectures, tools, design methodologies, test and applications.



Topics of interest:

The topics of interest include, but are not limited to:

1.      Embedded Hardware Support: System-on-a-chip, DSPs, hardware specification, synthesis, modeling, simulation and analysis at all levels for low power, power-aware, testable, reliable, verifiable systems, performance modeling, validation, security issues, real-time behavior, and safety critical systems, etc.

2.      Embedded Software: Compilers, assemblers and cross assemblers, programming, memory management, object-oriented aspects, virtual machines, scheduling, concurrent software for SoCs, distributed/resource aware OS, OS and middleware support, etc.

3.      Embedded System Architecture: Heterogeneous multiprocessors, reconfigurable platforms, memory management support, communication, protocols, network-on-chip, real-time systems, and embedded microcontrollers, etc.

4.      Hardware/Software Co-design: Methodologies, test and debug strategies, real-time systems, interaction between architecture and software design, specification and modeling, design representation, synthesis, partitioning, estimation, design space exploration beyond traditional hardware/software boundary, theory and algorithms, etc.

5.      Real-time Systems: All real-time related aspects such as software, distributed real-time systems, real-time kernels, real-time OS, task scheduling, multitasking design, etc.

6.      Power and Energy-aware Computing: Power or energy-related algorithms, systems, models, architectures, tools, design and applications, etc.

7.      Testing and Verification: All aspects of testing including design-for-test, test synthesis, built-in self-test, embedded test, and all aspects of verification for embedded and system-on-a-chip systems.

8.      Sensor Networks: Architecture, protocols, software, applications, technologies, etc.

9.      Application-specific Processors and Devices: Network processors, real-time processor, media and signal processors, application specific Hardware accelerators, reconfigurable processors, low power embedded processors, bio/fluidic processors, bluetooth, handheld devices, flash memory chips, etc.

10.  Industrial Practices and Benchmark Suites: System design, processor design, software, tools, case studies, trends, emerging technologies, experience maintaining benchmark suites, representation, interchange format, tools, copyrights, maintenance, reference implementations, and metrics, etc.

11.  Supporting Technologies: System on a Programmable Chip (SoPC), Field Programmable Gate Arrays (FPGA), and other technologies that assist in the design of embedded systems, including tool support, design methodologies, and applications.

12.  Embedded Computing Education: Courses, textbooks, teaching tools and methods.

13.  Emerging New Topics: New challenges for next generation embedded computing systems, arising from new technologies (e.g., nanotechnology), new applications (e.g., ubiquitous computing, embedded internet tools), new principle (e.g., embedded Engineering), etc.


Submission Information:

Submitted papers should represent original, substantive research results. We will not accept any paper which, at the time of submission, is under review for or has already been published (or accepted) for publication in another conference or journal venue. Submissions should include an abstract, 5-10 keywords, the e-mail address of the corresponding author, and must not exceed 25 pages, including tables and figures, in PDF or PostScript format. Submission of a paper should be regarded as assurance that, should the paper be accepted, at least one of the authors will attend the conference to present the work.

Contributions will be reviewed by at least three reviewers from both Program Committee and external reviewers for relevance and technical contents on basis of papers. Accepted papers with at most 8 pages will be published by IEEE Computer Society Press as proceedings of the ICPP-2006 workshops. Selected papers will be appeared on a special issue of Journal of Embedded Computing from IOS Press, The Netherlands.

Submissions to IWEC 2006 will be conducted electronically on the workshop website. Authors unable to access the Internet may send 4 hard copies of the paper to:


Prof. Salvatore Vitabile

Department of Computer Engineering

University of Palermo

Viale delle Scienze, Edificio 6

90128, Palermo, Italy


Tel: +39 091 238 264 Fax: 39 091 652 9124


Important Deadlines:

Paper submission Due

 February 01, 2006

Notification of Acceptance

 April 01, 2006

Final camera-ready paper

 May 01, 2006


Conference Chairs :

Prof. Laurence T. Yang

(Steering committee chair)

 St. Francis Xavier University, Canada


Dr. Lorenzo Verdoscia

(General Co-Chair)


ICAR, National Research Council (CNR), Italy



Prof. Antonio Gentile

(General Co-Chair)


 University of Palermo, Italy


Prof. Salvatore Vitabile

(Program Co-Chair)


University of Palermo, Italy


Prof. Ben A. Abderazek

(Program Co-Chair)


Graduate School of Information Systems

National University of Electro-communications, Japan



Program Committee:

Neil Audsley 

 University of York, UK

Xing Cai

University of Oslo, Norway

Jiannong Cao

Hong Kong Polytechnic University, P.R.China

Sek M. Chai Motorola USA

Naehyuck Chang

Seoul National University, Korea

Albert Cheng

University of Houston, USA

Luca Fanucci University of Pisa, Italy

Tony Givargis

University of California at Irvine, USA

Luis Gomes Universidade Nova de Lisboa, Portugal

Rajiv Gupta

The University of Arizona, USA

Houcine Hassan Polytechnic University of Valencia, Spain

Michael S. Hsiao

Virginia Tech and State University, USA

Pao-Ann Hsiung
National Chung Cheng University, Taiwan
Kazuki Joe
Nara Woman's University, Japan
Eugene John University of Texas at San Antonio

Ryan Kastner

University of California at Santa Barbara,USA

Yu-Kwong Kwok
University of Hong Kong, P. R. China
Yann-Hang Lee Arizona State University, USA

Francesco Leporati

University of Pavia, Italy

Abelardo Lopez-Lagunas ITESM, Mexico

Tao Li

University of Florida, USA

Shih-Wei Liao

Intel, USA

Man Lin

St. Francis Xavier University, Canada

Alberto Macii

Politecnico di Torino, Italy

Koji Nakano
Hiroshima University, Japan
Nicolas Navet LORIA, France
John O'Donnell
University of Glasgow, UK
William H. Robinson Vanderbilt University, USA
Zili Shao Hong Kong Polytechnic University, China

Filippo Sorbello

University of Palermo, Italy

Tarek Taha Clemson University USA
Farn Wang

National Taiwan University, Taiwan

D. Scott Wills Georgia Institute of Technology, USA
Linda M. Wills Georgia Institute of Technology, USA
Jingling Xue University of New South Wales, Australia
Fan Zhang Hong Kong University of Science and Technology
Youtao Zhang University of Pittsburgh, USA
Huiyang Zhou University of Central Florida, USA
Dakai Zhu University of Texas at San Antonio, USA
Yun Zhu University of Science and Technology of China